China EUV Breakthrough and the Rise of the ‘Silicon Curtain’
Inside a secure facility overseen by the Central Science and Technology Commission, Chinese engineers have activated an Extreme Ultr...
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AI Directs UFS Advancement
The next Universal Flash Storage (UFS) standard has yet to be released, but the standards organization overseeing it has made the unc...
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Marvell Eyeing Connectivity as the Next Big Thing in AI
At this year’s Marvell Industry Analyst Day, held on Dec. 9, Marvell Technology’s President and chief operating officer Chris K...
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Race to Find the Next Nvidia in Quantum Computing
Qilimanjaro CEO Marta Estarellas talks about the current boom of QC and its future.The global quantum computing (QC) sector is ex...
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Race to Find the Next Nvidia in Quantum Computing
Qilimanjaro CEO Marta Estarellas talks about the current boom of QC and its future.The global quantum computing (QC) sector is ex...
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Applied Materials, BESI Push Die-to-Wafer Hybrid Bonding Toward High-Volume Manu
At SEMICON Europa this week, Applied Materials and BE Semiconductor Industries (BESI) gathered a small group of journalis...
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